{"product_id":"11111111111-副本-5","title":"Via-in-Pad with Resin Filling PCB","description":"\u003ch1 style=\"text-align: center;\" class=\"MsoNormal\"\u003e\u003cstrong\u003eStandard Printed Circuit Board Ltd.\u003c\/strong\u003e\u003c\/h1\u003e\n\u003cp style=\"text-align: center;\" class=\"MsoNormal\"\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cspan\u003eThe Via-in-Pad with Resin Filling PCB technology encapsulates conductive vias directly beneath component pads with a specialized resin, creating a perfectly flat and seamless surface that prevents solder wicking, enhances reliability, and enables the high-density routing essential for miniaturized, high-performance electronic designs.\u003c\/span\u003e\u003c\/p\u003e","brand":"StandardPCB","offers":[{"title":"Default Title","offer_id":51852666536117,"sku":null,"price":0.0,"currency_code":"CNY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0698\/8804\/9333\/files\/PCB_5c19ba0e-ea78-46af-93f9-56c03314a55b.jpg?v=1759977246","url":"https:\/\/spcb.cn\/zh\/products\/11111111111-%e5%89%af%e6%9c%ac-5","provider":"StandardPCB","version":"1.0","type":"link"}