Have questions? We have answers! Browse the FAQ section below to quickly find solutions to common problems. If you don't see what you need, feel free to contact us for further assistance.
Technology & Innovation
Standard process achieves 3mil, while HDI boards support 2mil trace width/spacing, ideal for 5G communication modules.
We guarantee ±7% impedance tolerance and provide stack-up design recommendations to ensure signal integrity.
This service is not currently available.
We utilize fully automated placement machines (±0.025mm accuracy) and nitrogen reflow soldering, achieving <5% void rate for BGAs.
Staggered Via is an HDI board design technique that prevents via overlap. It improves yield through routing sequence constraints - see our tutorial video for details.
Rigid boards suit fixed structures (e.g., mainboards) while flexible PCBs (FPC) fit bendable applications (e.g., wearables). We support hybrid designs combining both.
Standard 1oz (35μm), with options from 0.5oz to 3oz. Thicker copper is recommended for high-current applications (e.g., power modules).
