Have questions? We have answers! Browse the FAQ section below to quickly find solutions to common problems. If you don't see what you need, feel free to contact us for further assistance.
Advanced Manufacturing Infrastructure
We specialize in producing high-quality double-sided to multi-layer PCBs (up to 20 layers), with advanced support for:
- HDI (High-Density Interconnect) boards
- Aluminum-based (metal core) PCBs
- Other specialized processes to meet your unique requirements.
We support this with staggered via technology and advanced layer-to-layer alignment processes to ensure the reliability of HDI boards. For detailed design rules, please refer to the technical documentation.
Standard process supports 4/4 mil (0.1 mm), while advanced process can achieve 3/3 mil. Specific capabilities depend on material and layer count evaluation.
Brand Capabilities & Strategy
As a global leader in PCB intelligent manufacturing, we specialize in full-chain services from "rapid prototyping to mid-volume production," combining German engineering standards with China's smart manufacturing efficiency to empower global innovation.
With dual manufacturing hubs in Zhuhai and Jiangxi, our current monthly capacity is 150,000 sqm. The new Jiangxi smart factory (operational by 2025) will boost annual capacity beyond 2 million sqm.
To establish service networks in 80+ countries, delivering on our "24-hour response, 72-hour global delivery" commitment while improving clients' R&D efficiency by 40%.
With 20+ years of expertise serving industry leaders like Intel and Huawei, plus UL, RoHS, ISO 9001 & 14001 certifications, we deliver guaranteed quality and reliable on-time delivery.
We focus on fast prototyping (fastest delivery in 48 hours) and medium batch production. We have two factories in southern China. 20 years of experience ensures high cost performance and stable quality.
The factory is located in southern China, with a superior geographical location, convenient for serving global customers efficiently.
We support orders ranging from single prototypes to thousands of units, seamlessly covering R&D trials to full-scale production.
Design Support
Yes, all orders include a complimentary DFM (Design for Manufacturability) report to preemptively address production risks and ensure design feasibility.
We accept mainstream file formats including Gerber (RS-274X), IPC-356, ODB++, and Altium Designer, with Gerber + drill files recommended for optimal compatibility.
We support Altium 365 cloud collaboration, enabling real-time synchronization of design modifications and production requirements (pre-configuration required).
Full-Range Manufacturing Capabilities
We support 1-32 layer multilayer boards, with HDI capability up to 20 layers, featuring laser blind/buried vias with ±0.05mm precision.
Yes! We specialize in multilayer rigid-flex boards with over 100,000 bend cycles, widely used in wearable devices.
Including heavy copper (6oz), RF/microwave boards, ceramic substrates, and metal-core boards for extreme environment applications.
We provide Rogers (RO4000 series), Taconic, Isola and other high-frequency materials with customizable dielectric constants from 2.2 to 10.2.
Industry Knowledge
Green solder mask is cost-effective, environmentally friendly, and has mature manufacturing processes. Other colors are typically used for prototype identification or special applications.
ENIG provides a flatter surface for high-density pads, while HASL is more cost-effective but less smooth, making it suitable for standard boards.
Blind vias connect outer to inner layers, while buried vias are entirely within inner layers. Both require HDI technology and enable high-density routing.
Industry Solutions
High-frequency material selection, strict impedance control, low-loss copper foil, and PTFE hybrid lamination technology.
We use high-TG materials (170°C+), conformal coating, and 100% functional testing, with UL certification compliance.
Heavy copper design (2-6oz), enhanced thermal dissipation structures, and 72-hour high/low temperature cycling tests.
Ultra-thin flexible boards (0.2mm), miniaturized component placement, and high-precision impedance matching.
Materials & Processes
Default color: Green (most cost-effective).
Optional colors: White, Black, Blue, Red, etc.
Special colors require additional confirmation of lead time.
Yes, we support high-frequency materials such as Rogers and Taconic, ideal for 5G, radar, and other high-frequency applications.
We offer various surface finishes including HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), and immersion silver. ENIG is recommended for high-precision pads.
Quality Assurance & Certifications
Through comprehensive AI quality control (AOI+SPI+flying probe testing) and IPC Class 3 standards, achieving 99.99% yield rate.
We are certified to ISO 9001, UL, RoHS, and REACH standards, ensuring compliance with international requirements.
While we hold ISO9001 certification, our current focus is on security electronics, medical, and communication sectors.
All products comply with RoHS 2.0, REACH, and halogen-free certifications, with supporting compliance test reports available upon request.
We use fully automated production lines with AOI inspection, 100% testing for critical processes, and provide CPK reports for quality verification.
Yes, please specify impedance requirements and stack-up in your design files. We guarantee ±10% accuracy through simulation and physical testing.
Rapid Delivery, Cost Optimization & Order Services
24-hour express prototyping (single/double-layer boards), with volume orders delivered in 7-12 days—50% faster than industry average.
Standard double-layer PCBs take 48 hours, while 4-layer PCBs require 3-5 days, subject to complexity and order volume.
Upload your Gerber files on our website【spcb.cn】 for an instant quote, or contact our sales team for manual review of complex requirements.
We use Grade-A materials + automated production to cut costs by 15%, supporting flexible orders from 1-5000pcs with no MOQ restrictions.
Yes! Expedited orders get priority scheduling, with fastest batch delivery in 5 days (additional rush fee % applies).
Domestic orders over ¥5000 enjoy free shipping (SF/Deppon). For international orders, we provide DDU Fedex dedicated service with transparent freight rates.
Yes, expedited orders are available with an additional fee, and the fastest delivery can be compressed to 24 hours.
Service Process & Support
Log in to our "Instant Quotation System" on the official website and upload your Gerber files to receive a detailed quote within 5 minutes.
Yes! Our engineering team delivers manufacturability feedback within 24 hours, helping eliminate 90% of design risks.
We accept Gerber RS-274X, ODB++, IPC-2581, etc. Drill files and panelization instructions must be included.
Each client is assigned a "Project Manager + Technical Consultant" with support in English, Chinese, Japanese, and Korean.
Shipping & After-Sales Service
We provide DDP service with pre-declared HS codes and compliance certificates, ensuring customs clearance within 24 hours after port arrival.
We provide RMA reports within 72 hours, offering free rework or replacement while conducting batch traceability to optimize production processes.
Email response required for completion.
We offer international express options (DHL, FedEx, SF Express) as well as bulk shipping via sea/air freight, with both prepaid and collect payment options available.
We initiate investigations within 24 hours of feedback. Upon confirmation of responsibility, we provide free re-production or refunds, along with a detailed failure analysis report.
Technology & Innovation
Standard process achieves 3mil, while HDI boards support 2mil trace width/spacing, ideal for 5G communication modules.
We guarantee ±7% impedance tolerance and provide stack-up design recommendations to ensure signal integrity.
This service is not currently available.
We utilize fully automated placement machines (±0.025mm accuracy) and nitrogen reflow soldering, achieving <5% void rate for BGAs.
Staggered Via is an HDI board design technique that prevents via overlap. It improves yield through routing sequence constraints - see our tutorial video for details.
Rigid boards suit fixed structures (e.g., mainboards) while flexible PCBs (FPC) fit bendable applications (e.g., wearables). We support hybrid designs combining both.
Standard 1oz (35μm), with options from 0.5oz to 3oz. Thicker copper is recommended for high-current applications (e.g., power modules).
Value-Added Services
Yes, we offer full-range services from PCB fabrication to component procurement, SMT assembly, and testing to simplify your supply chain.
We provide advanced design support including SI/PI simulation and EMC optimization. Please schedule an assessment with our engineering team in advance.
Yes, please provide detailed mechanical drawings and application requirements. We'll evaluate technical feasibility and propose solutions.
